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Precision Surfacing Solutions

Peter Wolters AC microLine® 2000-P4

  • Model: ac-microline-2000-p4
  • Type/Application: Double Sided
  • Plate-Diameter (mm): 2000 mm
Product Description

The high productivity double-sided polishing machines of the Peter Wolters AC microLine range display state-of-the-art design and concept. The modular system of main components together with the precision of the latest control-, drive and measuring technologies superb process reliability and make the system simple to operate. Easily removable machine linings and fully covered process areas give the best accessibility and industrial safety. For automatic loading and unloading, the upper wheel can be swung out. For further increase of productivity, all machines can be equipped with automation setups. Choose between semi and fully automated versions. These automation choices guarantee optimal unit cost combined with high throughput and, therefore, the most economic solution. With its 3rd generation of the Peter Wolters AC microLine® 2000, we offer solutions for double-side grinding and polishing of wafers from a diameter of 200?mm up to 450?mm. As a result of its unique machine concept, Peter Wolters AC microLine® 1500 P3 and 2000 P4 are the most flexible machines for supporting all future wafer requirements. We are constantly setting a new benchmark in precision, quality, efficiency, and cost of ownership. UPAC Theunique and primary patented UPAC (Upper Platen Adaptive Control) system is the feature needed to maintain a parallel and stable gap profile between the upper and lower working wheel while processing wafers. Only the UPAC technology provides accuracy in gap adjustment to compensate for any wheeldeflection caused by thermal expansion or force induced stress that is required to successfully perform Planetary Pad Grinding on double side machining tools. A large contact zone between wafer and grinding surfaces result in reduced local stress and a uniform grinding pattern. No center marks as known from conventional cup wheel grinders are created. The improved local and global wafer flatness after PPG, in combination with reduced sub surface damages result in shorter polishing times compared to conventional lapping or grinding. Using the same tool platform for PPG and DSP helps reduce costs for operator training and maintenance.

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