HFP 300 - High-Throughput CMP-System for 300 mm Wafer Planarization

Peter Wolters AG is developing, producing and marketing CMP systems for wafers up to 300 mm. The HFP 300 is a new CMP system on the market for 300 mm wafer processing. With its superior high throughput the system is a frontrunner for a new generation which is developed to increase the productivity and to reduce the Cost of Ownership dramatically. Additionally, it is designed to be capable for <100 nm design rules. The HFP 300 is a

turn-key solution from one supplier, including the necessary process know how. Its cluster design integrates the wafer handling and cleaning units. The wafer handling and the new cleaner concept are optimized to reach leading high throughput values and reliability standards. The cleaner is designed to produce the best cleaning results with the capability also for future process demands. The system can be used for various applications, e.g. at chipmakers for their typical applications as well as at prime wafer manufacturers. The advanced design of the HFP 300 with a fourcarrier- on two-platen-technology enables the system to run independent multi-step processes. The use of our independently controlled carriers, one- or multi-step applications can be optimized to meet high-throughput demands while reducing the Cost of Ownership dramatically. The unique solid design of the HFP 300, based on a rigid cast iron frame, delivers the precondition for high tool reliability, high removal rates and best reproducible polishing results.

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