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Novellus
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PM 300
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The new PM300
: Technical Facts
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Polishing head
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Wafer
diameter
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300 mm
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Rotating
speed
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0 - 125
rpm
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Backside
pressure
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0 - 200
kPa
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Polishing
downforce
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300 - 4000
N
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Designs
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Multizone
control, edge influence
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Main polishing
tables 1 + 2
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Diameter
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900 mm
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Rotating
speed
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0 - 125
rpm
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Temperature
control
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20 - 60 °C
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End Point
Detection
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Motorcurrent,
optical
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Secondary
polishing table
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Diameter
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430 mm
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Rotating
speed
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0 - 125
rpm
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Temperature
control
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20 - 60 °C
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Pad conditioner
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Down force
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0 - 350 N
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Disc
diameter
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120 mm
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Rotating
speed
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0 - 80 rpm
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High
pressure conditioning
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0 - 100
bar
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Cleaner
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2 brush
modules, 4 brushes
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Rotating
speed: 0 - 200 rpm brush 0 - 200 rpm wafer
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On board
dilution preparation
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e.g.
NH4OH, citric acid, DHF
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Spin-rinse
dryer
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Rotating
speed: 0 - 2000 rpm
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System
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Weight
total system
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11.000 kg
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Length x
width x height
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7123 x
1600 x 2200 mm
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Floor
Space
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˜ 11,4 qm
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Interface
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SECS II
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GEM, CIM
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